JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patent pending Hydrogen-based recipes. The system has been proven for Cu, PCC, Ag, Au bond wires and for advanced package types like 3D, SiP WLCSP, BOAC; all without process induced damage for reliability test and failure analysis.
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Learn more at https://jiaco-instruments.com/
Tools: The standard-setting security testing suite for embedded and connected devices ranging from mobile to smartcards and automotive to IoT.
Services: Riscure can help companies with specific market goals such as certification, IP protection or security caused cost and liability reduction through security hardening.
We work with our customers during development stages, which helps them to avoid security-related redevelopment, prepare for the market requirements and certifications.
Learn more at https://www.riscure.com
Idaho Scientific is an embedded security company. Our proven, easy-to-integrate and low maintenance solutions address Government cybersecurity and anti-tamper Requirements. We offer a suite of FPGA/ASIC security IP cores that can be integrated individually or selected as a bundled security solution to establish a secure and defensible foundation for your embedded system. Security IP includes side-channel resistant crypto cores, inline memory encryption, secure processing, secure boot, and a Root of Trust with extension of security to an Intel processor.
Learn more at https://www.idahoscientific.com
VASCO 2 (ASIC vehicle for component security) integrates innovative and patented hardware security building blocks on 22 nm FD-SOI silicon. It enables all types of standard or customized tests to validate these technologies in operational conditions in order to prepare a transfer to industry. VASCO 2 highlights the relevance and characteristics of these hardware block for industry by matching current challenges in hardware security:
VASCO has been developed at Cyber Security Platform of CEA Leti (and CEA List), home to experts who collaborate with over thirty industrial partners through bilateral contracts, collaborative projects, or common laboratories.
The platform offers two types of collaborations and services:
Leti (english) - Cyber Security Platform (leti-cea.com)
See also Integrated Circuits design Platform at CEA Leti:
Leti (english) - Integrated Circuits Design Platform (leti-cea.com)
CEA-Leti, a technology research institute at CEA Tech, pioneers micro and nanotechnologies, tailoring differentiating applicative solutions that ensure competitiveness in a wide range of markets. The institute tackles critical challenges such as healthcare, energy, transport and ICTs.
Its multidisciplinary teams deliver solid expertise for applications ranging from sensors to data processing and computing solutions, leveraging world-class pre-industrialization facilities.
CEA-Leti builds long-term relationships with its industrial partners - global companies, SMEs and startups - and actively supports the launch of technology startups.
Learn more at https://www.leti-cea.fr/cea-tech/leti/Pages/Accueil.aspx
Flex Logix is a reconfigurable computing company providing leading edge eFPGA and AI Inference technologies for semiconductor and systems companies. Flex Logix eFPGA enables volume FPGA users to integrate the FPGA into their companion SoC, resulting in a 5-10x reduction in the cost and power of the FPGA and increasing compute density which is critical for communications, networking, data centers, microcontrollers and others. Its scalable AI inference is the most efficient, providing much higher inference throughput per square millimeter and per watt. Flex Logix supports process nodes from 180nm to 7nm, with 5nm and 3nm in development. Flex Logix is headquartered in Mountain View, California and has an office in Austin, Texas.
Learn more at https://flex-logix.com